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PCBSINO PCB manufacturing capabilities:

PCB capability file

  •  
    Parameter name
    Unit
    Capability
    1
    surface
     
    Lead-free HAL, the whole board gold, ENIG, OSP, Immersion Tin, Immersion Silver, gold plated
    2
    Copper peel strength
    N/cm
    7.8
    3
    Flame-retardant
     
    94V-0
    4
    Inner processing
     
    Brown of
    5
    Minimum thickness of the inner plate
    mm
    0.05
    6
    Drill hole (maximum)
    mm
    6.3
    7
    Insulation thickness (minimum)
    mm
    0.075 (limit HOZ bottom copper)
    8
    Impedance tolerance
    %
    ±5Ω(<50Ω),±10%(≥50Ω);≥50Ω can be±5%
    9
    Ion contamination
    ug/cm2
    ≤1
    10
    Rogers Material type
     
    Ro4350,Ro4350B,Ro4003,Ro4003C,Ro3003,RT5880
    11
    Taconic material type
     
    RF-35,TLX-8,TLC-32
    12
    Halogen-plate type (normal Tg)
     
    SY S1155, S0155 prepreg
    13
    High Tg Laminate type
     
    SY 170℃ High Tg
    14
    Pressing blind buried via multiple production
     
    Pressing the same side≤3 times
    15
    Circuit board layers
    Layer
    2005/1/28
    16
    Copper
    um
    12、18、35、70
    17
    FR-4 prepreg
     
    7,628,211,610,803,310,000
    18
    Rogers prepreg
     
    Ro4403(0.10mm),Ro4450B(0.10mm),
    19
    Material mixed with pressure
     
    Rogers/Taconic/Arlon and FR-4
    20
    Solder mask color
     
    Green, yellow, black, blue, red, white, green matt
    21
    Character ink colors
     
    White, yellow, black
    22
    Groove cutter diameter of the smallest
    mm
    0.6
    23
    Drilling than the maximum thickness
     
    20:1 (excluding ≤ 0.2mm radius, need assessment is greater than 12:1)
    24
    Hole tolerance (compared with the CAD data)
    mil
    ±3
    25
    Minimum width of the inner wire (18um based copper, before compensation)
    mil
    3
    26
    Minimum width of the inner wire (35um based copper, before compensation)
    mil
    3
    27
    Minimum width of the inner wire (70um based copper, before compensation)
    mil
    4
    28
    Minimum width of the outer conductor (12,18 um based copper, before compensation)
    mil
    4(18um),3(12um)
    29
    Minimum width of the outer conductors (35um based copper, before compensation)
    mil
    4.5
    30
    Minimum width of the outer conductors (70um based copper, before compensation)
    mil
    6
    31
    Minimum line to the outer disk, disk to disk space (after compensation)
    mil
    3 (12,18 um) k can be partially 2.5,3.5 (35um), 5 (70um), 6 (105,140 um)
    32
    Minimum mesh width
    mil
    5 (12,18,35 um), 10 (70 um)
    33
    Minimum grid spacing
    mil
    5 (12,18,35 um), 8 (70 um)
    34
    Minimum pad diameter
    mil
    12 (0.10mm Mechanical or laser drilling)
    35
    Maximum dry film sealing slot
     
    5mm * 3.0mm; sealing unilateral than 15mil
    36
    Diameter of dry film sealing
    mm
    4.5
    37
    Minimum width of sealing unilateral dry
    mil
    10
    38
    Outer minimum width through-hole pad unilateral
    mil
    4 (12,18 um) can be partially 3.5,4.5 (35um), 6 (70um), 8 (105um), 10 (140um)
    39
    BGA pad diameter of the smallest
    mil
    10 (water, gold plate 7mil)
    40
    Drilling into the lead body from the smallest (non-buried blind plate)
    mil
    6 (≤ 8 layers), 8 (≤ 12 layers), 10 (≤ 28 layers)
    41
    Inner isolation ring width (unilateral) minimum
    mil
    8 (≤ 6-layer), 10 (≥ 8 layer) may be partially cut plate 8
    42
    Minimum width of the inner pad unilateral
    mil
    5 (18,35 um, can be partially 4.5), 6 (70um), 8 (105um)
    43
    Minimum bandwidth of the inner isolation
    mil
    8
    44
    Copper inner plate edges do not drain the minimum distance
    mil
    10
    45
    Minimum width etched logo
    mil
    8 (12,18 um), 10 (35um), 12 (70um)
    46
    Inner and outer completed the largest copper thickness
     
    5OZ (175um)
    47
    Finished copper thickness (18um base copper)
    um
    ≥ 35 (typical value of 52um, which 1.5OZ)
    48
    Finished copper thickness (35um base copper)
    um
    ≥55
    49
    Finished copper thickness (70um base copper)
    um
    ≥90
    50
    Maximum height of finger
    inch
    2
    51
    Nickel Nickel whole plate thickness
    um
    2005/3/5
    52
    Jin Jin the whole plate thickness of nickel
    um
    0.025-0.10
    53
    Nickel Nickel Immersion Gold Thickness
    um
    2005/3/5
    54
    Immersion nickel gold gold thickness
    um
    0.025-0.10
    55
    Nickel-plated nickel-thick gold finger
    um
    2005/3/5
    56
    Jin Jin finger thick nickel
    um
    0.25-1.3 (required value refers to the thinnest point;> 0.76 to be reviewed)
    57
    Hole copper thickness at the thinnest
    um
    Average of 25, minimum single points of ≥ 20
    58
    Free hole diameter precision welding device
    mil
    ± 2
    59
    HAL solder / pure tin thickness of the thinnest
    um
    0.4 (surface of a large tin)
    60
    Green oil minimum unilateral fenestration (clearance degrees)
    mil
    2 (the local water board gold 1.5, other local board 1)
    61
    Green oil plug hole drilling diameter
    mm
    0.65
    62
    Green oil cap unilateral minimum line width
    mil
    2.5 (allowing local 2mil)
    63
    Green oil window width of the smallest word
    mil
    8
    64
    Minimum thickness of the green oil
    um
    10
    65
    The thickness of the oil hole cover
    um
    2005/5/8
    66
    Minimum separation of oil and carbon pad
    mil
    8
    67
    Blue plastic cover line or pad unilateral minimum
    mil
    2
    68
    Minimum width of solder bridge
    mil
    4 (green), 5 (other colors) (bottom copper ≤ 1OZ) (bottom copper 2-4OZ, all according to 6mil)
    69
    Solder hardness
    H
    6
    70
    Blue Gum and the minimum separation pad
    mil
    12
    71
    Blue and white plastic mesh plug hole diameter
    mm
    2
    72
    Blue rubber thickness
    mm
    0.2-0.5
    73
    Character width and height of the smallest (12,18 um based copper)
     
    trace Width 4mil; height: 25mil
    74
    Character width and height of the smallest (35um base copper)
     
    trace Width 5mil; height: 30mil
    75
    Character width and height of the smallest (70um base copper)
     
    trace Width 6mil; height: 45mil
    76
    Characters with the minimum isolation pad
    mil
    6
    77
    Maximum finished size of double-sided
    inch
    23 * 35 (long side needs assessment beyond the 30inch)
    78
    Thickness
    mm
    0.13-7.0 (thickness ≤ 0.5mm when the make-up ≤ 18in)
    79
    Thickness Tolerance (≤ 1.0mm)
    mm
    ± 0.1
    80
    Thickness Tolerance (> 1.0mm)
    mm
    Thickness ± 10%
    81
    Special thickness tolerances (no layer structure requirements)
    mm
    ≤ 2.0 board ± 0.1; 2.0-3.0 board ± 0.15; ≥ 3.0 ± 0.2 board
    82
    Mode shape
     
    Milling shape; V-CUT; bridged; Post Standard hole
    83
    Overall minimum diameter cutter
    mm
    0.8
    84
    Dimension accuracy (edge to edge)
    mil
    ± 4 (complex shape, with this requirement within the tank needs assessment)
    85
    V-CUT point specifications
     
    20°,30°,45°,60°
    86
    V-CUT point of tolerance
    o
    ±5°
    87
    V-CUT symmetry tolerance
    mil
    ±4
    88
    V-CUT tendon thickness tolerances
    mil
    ±4
    89
    Minimum spacing between the finger
    mil
    6
    90
    TAB does not hurt the next finger down the minimum distance
    mm
    7(Refers to the automatic chamfering)
    91
    Finger chamfer angle tolerance
     
    ±5°
    92
    Finger thickness tolerances than chamfer
    mil
    ±5
    93
    Radius of the smallest interior angle
    mm
    0.4
    94
    Warpage limit the ability
    %
    0.1 (≤ 0.3 to be reviewed)
    95
    PTH slot minimum tolerance
    mm
    ±0.15
    96
    Completion of the minimum plate
    mm
    10*10
    97
    Pitch board edge minimum distance test
    mm
    0.5
    98
    Minimum resistance test
    Ω
    10
    99
    Maximum insulation resistance test
    100
    100
    Maximum test voltage
    V
    250
    101
    Minimum test pad
    mil
    3.9
    102
    Minimum distance between the test pad
    mil
    3.9
    103
    The maximum test current
    mA
    200
    104
    Thickness limit resistance test hole
    mm
    0.38-5.0
    105
    Resistance test hole diameter limit
    mm
    min: 0.62mm, max Heavy 0.25mm than the test plate board
    106
    Carbon-carbon oil and minimum oil separation
    mil
    12
    107
    Unilateral minimum carbon oil cap line
    mil
    2
    108
    EXCELLON rig
    two processing capacity
    0.05-7.0mm,max 18.5*30inch
    109
    HITACHI rig
    two processing capacity
    0.05-7.0mm,max 27.2*21.0inch
    110
    Milling
    two processing capacity
    0.05-7.0mm,max 25.5*21.5inch
    111
    Photoplotter
     
    max 32*26inch
    112
    Exposure red chip
     
    max 35*28inch
    113
    LDI Exposure
    largest board 26*32in
    0.05-5.0mm,max 21*29inch
    114
    Red film developing machine
     
    Not more than 19.7inch unilateral
    115
    Nickel gold graphics
     
    0.4-3.2mm,max 17*18inch
    116
    Deburring brushing machine
     
    0.50-7.0mm,min 8*8inch
    117
    Inner and outer line brushing machine
     
    0.10-4.0mm,min 9*9inch
    118
    Screen printing machine grinding plate
     
    0.50-7.0mm,min:9*9inch
    119
    A second copper plating line
     
    0.10-7.0mm,max 24*90inch
    120
    In addition to plastic PTH
    two processing capacity
    0.10-7.0mm,max 24*32in
    121
    Hitachi automatic packing machine
     
    0.10-3.2mm,min 8*8in,max 24*24in
    122
    DES line
     
    0.10-7.0mm,max 7*7inch
    123
    PE punching machine
     
    0.08-0.8mm,min 12*16inch;max 24*28inch
    124
    Horizontal Brown of the line
     
    0.10-1.6mm,min 10*10inch
    125
    X-RAY drill drone
     
    0.3-7.0mm,min 12*14in;max 24*30in
    126
    SES line
     
    0.10-7.0mm,max 7*7inch
    127
    ORC Exposure
     
    0.05-7.0mm,max 32*24inch
    128
    Fine Arts Exposure
     
    0.05-3.2mm,max 18*24inch
    129
    CSUN Exposure
     
    0.05-7.0mm,max 25*32inch
    130
    SK-75E AOI machine
    two processing capacity
    0.05-6.0mm,max 23.5*23.5inch
    131
    VRS machine
    two processing capacity
    0.05-6.0mm,max 23.5*23.5inch
    132
    Solder developing machine
     
    0.4-7.0mm,min 4*5inch
    133
    Laminating machine
    MASS LAM mathod
    0.075-7.0mm,max 27*32inch
    134
    HAL line before and after treatment
     
    0.4-4.0mm,min 7*7inch
    135
    Hot Air Leveling Machine
    two processing capacity
    0.6-4.0mm,min 5*5;max 20*25inch
    136
    EMMA tester
     
    0.4-7.0mm,max 30*24;min 3*3inch
    137
    Four-pin fx
     
    0.4-6.0mm,max 19.6*23.5inch
    138
    MV-300 test machine
     
    0.4-3.0mm,max 24*28inch
    139
    V-CUT machine
    <0.8mm only single board
    0.6-3.0mm, v-cut line perpendicular to the edge of not more than 18inch
    140
    Line processing
    customer supply
    min 8 * 8inch
    141
    Finger plating line
     
    0.8-2.0mm, either side of a row of non-board side of the finger to a distance of ≤ 8inch board
    142
    Arlon plate type
     
    AD350,AR1000,25FR,33N,Diclad527
    143
    Maximum thickness of 0.20mm drills
    mm
    2.5
    144
    Even the smallest hole diameter
    mm
    0.45
    145
    Copper inner yin and yang
     
    18/35, 35/70 (18/70 and does not meet the requirements of a need to review compensation etching)
    146
    The outer layer of copper foil of yin and yang
     
    18/35 (35/70, 18/70 and does not meet the requirements of a need to review compensation etching)
    147
    Impedance control panel plate type
     
    FR-4, FR-4 halogen, FR-4 High Tg, RO4000, 25FR Series
    148
    Minimum width of the outer conductor (105um based copper, before compensation)
    mil
    8
    149
    Minimum distance between the outer conductor (12,18 um based copper, after compensation)
    mil
    3.0(18um),2.5(12um)
    150
    Minimum distance between the outer conductors (35um based copper, after compensation)
    mil
    3.5
    151
    Minimum distance between the outer conductors (70um based copper, after compensation)
    mil
    5
    152
    Minimum distance between the outer conductor (105um based copper, after compensation)
    mil
    6
    153
    Minimum width of the inner conductor (105um based copper, before compensation)
    mil
    5
    154
    Minimum distance between the inner conductor (18um based copper, after compensation)
    mil
    3
    155
    Minimum distance between the inner conductor (35um based copper, after compensation)
    mil
    3.5
    156
    Minimum distance between the inner conductor (70um based copper, after compensation)
    mil
    4
    157
    Minimum distance between the inner conductor (105um based copper, after compensation)
    mil
    5
    158
    Body to guide the minimum drilling distance (blind buried plate)
    mil
    9 (a lamination); 10 (Pressing two or three times)
    159
    Blue rubber plug hole diameter aluminum
    mm
    4.5
    160
    Maximum finished size four-layer board
    inch
    22.5 * 33.5 (out of 30inch long side to be reviewed)
    161
    Six and above the maximum board size of the finished product
    inch
    22.5 * 26.5 (22.5inch long side than to be reviewed)
    162
    Milling the outer shape of the minimum distance is not exposed copper
    mil
    8
    163
    V-CUT does not leak to the graphics from the centerline of copper (H ≤ 1.0mm)
    mm
    0.3(20°),0.33(30°),0.37(45°),0.42(60°)
    164
    V-CUT does not leak to the graphics from the centerline of copper (1.0 <H ≤ 1.6mm)
    mm
    0.36(20°),0.4(30°),0.5(45°),0.6(60°)
    165
    V-CUT does not leak to the graphics from the centerline of copper (1.6 <H ≤ 2.4mm)
    mm
    0.42(20°),0.51(30°),0.64(45°),0.8(60°)
    166
    V-CUT does not leak to the graphics from the centerline of copper (2.5 ≤ H ≤ 3.0mm)
    mm
    0.47(20°),0.59(30°),0.77(45°),0.97(60°)
    167
    NPTH minimum hole diameter tolerance
    mm
    ± 2 (the limit +0, -0.05 or +0.05, -0)
    168
    Length of the finger surface
     
    Water, gold / Immersion Gold; hard gold plating
    169
    The second element
     
    max 24*28inch
    170
    Immersion gold
     
    0.2-7.0mm,min 6*6in,max 21*27in
    171
    High-frequency board make-up the maximum size (rogers, arlon, tyconic full range, high frequency board Jiangsu Taixing, providing high-frequency board)
    inch
    16*18
    172
    Taconic prepreg type
     
    TP-32(0.10mm)
    173
    0.15mm maximum thickness mechanical drilling
    mm
    1.20(≤8 layer)
    174
    0.10mm maximum thickness mechanical drilling
    mm
    0.60(≤6 layer)
    175
    Minimum aperture of laser drilling
    mm
    0.10 (depth ≤ 55um), 0.13 (depth ≤ 100um)
    176
    HDI board types
     
    1 + n +1,1 +1 + n +1 +1,2 + n +2 (n in order to be buried vias ≤ 0.3,2 comment)
    177
    Minimum inner channel
     
    3 (18um base copper), 4 (35um base copper), ≥ 3 channel
    178
    Minimum width of the outer conductor (140um based copper, before compensation)
    mil
    9
    179
    Minimum distance between the outer conductor (140um based copper, after compensation)
    mil
    7
    180
    Minimum width of the inner conductor (140um based copper, before compensation)
    mil
    7
    181
    Minimum distance between the inner conductor (140um based copper, after compensation)
    mil
    7
    182
    Ladder hole
     
    PTH and NPTH, large hole angle 130 degrees, a large hole diameter less than 6.3mm
    183
    RCC material
     
    Copper foil 12, the resin 65,80,100 um (after lamination 55,70,90 um)
    184
    Immersion tin tin thickness
    um
    0.8-1.5
    185
    Immersion silver silver thick
    um
    0.1-0.3
    186
    Hard gold plating gold thickness
    um
    0.15-1.3
    187
    Angle and size of the speaker hole
     
    Macroporous 82,90,120 degree, diameter ≤ 10mm
    188
    Halogen-free plate type (high Tg)
     
    SY S1165, PP for the S0165
    189
    Selective surface treatment
     
    ENIG + OSP, ENIG + G / F, spray the whole board gold + tin, full plate gilt + G / F, Shen silver + G / F, Shen tin + G / F
    190
    Bonding machine capacity
     
    0.5-6.0mm,max 24*32in,min 14*16in
    191
    Ability of the finished product washing machine
     
    0.2-5.0mm,max 24*24in,min 4*4in
    192
    Collimated Exposure Machine
     
    0.05-3.0mm,min 16*21in,max 22*25in
    193
    Milling depth control tank (side) or blind slot precision (NPTH)
    mm
    ±0.10
    Note: this capacity is top capability
    like trace to trace distance, top capability is 3 mil, but normally we design at 4-7mil
    via hole diameter can make 0.1mm diameter, but we design normally at 0.2mm
    for prototype with top capability PCB design layout, no any problem;
    for mass production, if your design layout base on top capability will lead to high cost PCB
    when design layout, make design tolerance a bit more larger than our top capability can drop PCB cost.


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