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Posted By:
pork_u_pine2000
Wed Aug 8, 2007 2:44 pm |
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I received some of the board material in question, and while it is
interesting it doesn't seem useful for anything I am building at the
moment.

Like you, my immediate thoughts are that it might be work for
mounting LEDs on a pre-stressed, curved surface, or the narrower
strips might serve for 'whiskers' on a robot of some sort.

But the stuff *is* really expensive, especially the narrow strips.

I have bought a good bit of 0.014 in double sided 1 oz copper FR4
board from 'abcfab' on eBay. The descriptions are a bit sketchy but
the product seems quite good and arrives reasonably quickly. I have
also purchased 0.030 in. and 0.060 in. board stock, as well as some
unlaminated 0.014 in. base material for experiments.

This source sells a variety of stock from 0.014 in. to 0.125 in. and
Cu copper weights up to 5 and 6 oz/in (sq).

I have also purchased unlaminated Kapton Polyimide in a variety of
thicknesses from 'PaperStreetPlastics'. I have been quite satisfied
by the quality and service from this source as well. I have used this
stuff for experimentation with flexible circuits using conductive
paints and/or inks. I've tried silver, cu, and carbon, so far.
Polyimide's's main claim to fame is that it is flexible and can
withstand solder temperatures.his material requires high resistance against repeated bending and suitability for the compact, high parts mounting density PCBs in small electronic devices, such as cellular phones, digital cameras, and notebook PCs. This material enables high density and 3D interconnection by laminating thin films that have superior resistance against heat, chemicals and flexural stress on copper clad.

Copper Clad Laminate
Material for Package Substrates
Material for Flexible PCB
Heat Dissipation Materials
Masslam
OLED
Application
ROHS Compliant
IPC Specification Number Flex PCB and Rigid-Flex PCB

Binding flexible and rigid boards structure together in same units as one part so called rigid-flex boards.
Features :
Better reliability, signal integrity, noise reduction, and impedance control.
Reduces mechanical space and device weight.
Improves design freedom HDI microvia.
Cost-saving alternative to multi-layer FPC.
Full range of products: Single-Sided, Double-Sided & Multi-Layer board
Material
Supply Name
Polyester
Polyimide
Layer
Single, Double, Multi Layer, Flex-Rigid
Base Material Thickness (um)
12.5/25/50/75/100
12.5/25/35/50
Copper conductor thickness (um)
18, 35, 50, 70, 105
Min Conductor Space and Width (mm)
0.075 +/- 0.02
Min Hole Dia (mm)
Dia. 0.2 +/- 0.03
Max Panel Size (mm)
1800 x 400 Flex-Rigid PCBs

Flex, TWINflex® and flex-rigid solutions for dependable system solutions

Rigid-flex circuit boards are those consisting of a combination of flexible and rigid circuit board areas and are always processed in a single delivery panel.

The rigid circuit board areas serve as the solid base to which components, control elements and connectors are added; they are joined together by the continous flexible circuitry.
These flexible connections make it possible to position and connect component-bearing rigid circuit boards functionally in difficult spatial configurations, thus saving space.

Rigid-flex technology will open up for evermore applications through standardization of materials and processes, especially considering the aspects of system costs and testability / reliability. FLEX &RIGID-FLEX CAPABILITIES
Rigid-flex circuitry provides a simple means to integrate multiple PCB assemblies and other elements such as display, input or storage devices without wires, cables or connectors, replacing them with thin,Rigid-Flex PCB

Rigid-flex PCBs combine the advantages of rigid and flexible printed circuit boards and can take great function of several rigid
boards interconnected Product type: Rigid-Flex PCB
Layer count: 8 layers
Material: Polymide+FR4 DuPont Home«Electronics«Semiconductor Packaging & Circuit Materials«Science of Semiconductor Packaging & Circuit Materials «Flexible Printed Circuit Technology
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Flexible Printed Circuit Technology
DuPont™ Kapton® polyimide film has been used in the electronics industry for over 40 years. Kapton® has excellent dielectric strength, thermal stability, chemical resistance, flexibility, and dimensional stability. While Kapton® is widely used in electrical applications such as insulation for field coils, motor and generator liners, as well as wire and cable insulation, it is particularly well suited for use as a dielectric substrate for flexible copper clad laminate. In fact, flexible circuit laminate is the largest single end use for Kapton® today. Kapton® HN is the primary dielectric core for adhesive based flexible circuits.
Adhesive Based Flex Circuit Laminate
Adhesive based flexible laminates are comprised of Kapton® film coated with adhesive on one or both sides and subsequently laminated to copper. There are two kinds of adhesive used in flex, epoxy and acrylic. They each have positive and negative attributes that may make one or the other more suitable for a specific end use. In some applications like actuator circuits for hard disk drives, the adhesive actually performs the critical function of keeping the copper in the "neutral axis". This enables the flex to bend many millions of cycles without failure. However, both acrylic and epoxy adhesives have inferior mechanical and electrical properties as compared to the Kapton® core. In certain applications, the presence of an adhesive layer actually inhibits the use of flexible circuits. Therefore, a solution was needed to eliminate the adhesive layer from the substrate.
Adhesiveless Flex Circuit Laminate
In response to this challenge, DuPont developed an all-polyimide laminate that incorporates a bondable polyimide adhesive at the surface to secure the copper foil. This laminate, named DuPont™ Pyralux® AP, opened the door to many new applications for flexible circuits. One example is high layer count rigid-flex boards. In this application, the adhesives’ high coefficient of thermal expansion (CTE) in the Z-axis created reliability problems when exposing the board to thermal cycling. The introduction of Pyralux® AP allowed the design and fabrication of rigid flex and multi-layer flex circuits with much higher layer counts and hole densities.
Also, with a maximum operating temperature (MOT) of 180C, compared to 105C for typical adhesive based laminates, many higher temperature applications became feasible. Its superior chemical resistance enabled the use of flex circuits in much harsher environments, such as that found in "under-the-hood" automotive applications. Probably most important, though, is the improvement in electrical properties. Adhesive based laminate systems have higher loss tangents and dielectric constants (Dk) and consequently, very high signal attenuation, especially at high frequencies. Pyralux® AP has a lower Dk that remains stable well into the Gigahertz range. Further, because it is available in a thickness of up to 20 mils, Pyralux® AP is ideal for circuitry requiring impedance control.
As the need for adhesiveless-based laminates began to emerge in the consumer market, DuPont developed an all-polyimide cast-on-copper laminate called DuPont™ Pyralux® AC. This laminate is produced in roll form, thus allowing roll-to-roll flex fabrication for high volume manufacturing. Additionally, this material is available in dielectrics as low as 20 um, allowing for increased flexibility, thinner form factors and lighter weight, all of which are key to the consumer electronics market.
Non Flex Circuit Polyimide Laminate pplications
Rapid PCB Prototyping
PCB structuring
Milling and Drilling
Contour Routing
Flexible and Rigid-Flexible PCBs
Laser Structuring
Through-Hole Plating
Multilayer
Surface finishing
SMT assembly
Testing and reworking
RF and Microwave
Surface machining
Special materials
Other applications in PCB manufacturing
Case Studies
Design Articles
SMT Stencils
PCB Processing
PCB Depaneling
LDS
Laser Micromachining
Flexible and Rigid-Flexible PCBs

Flexible and rigid-flexible printed circuit board
Flexible and rigid-flexible printed circuit boards usually cause difficulties in handling. To fix the boards on a work surface can cause some problems. To make the handling easier almost all LPKF systems can be equipped with a vacuum table. Reason to equip the circuit board plotter with a vacuum table is not only a safer positioning of the material, it is also to make the handling of the machine faster and more simple.

Since the base material of flexible printed circuit boards is always softer, HF tools are primarily used for the milling process. Another advantage of the HF tools is that they do not penetrate deeply into the material. Structuring a flexible printed circuit board is based on the same milling process of rigid base materials.

With rigid-flexible printed circuit boards, flexible PCB’s are connected together with rigid PCB’s. The production of rigid-flexible printed circuit boards is similar to the production of multilayer boards. The rigid PCB’s are structured in a panel, the area where the flexible portion is to be inserted remains unstructured in the panel, and is covered with a protective foil. The flexible PCB is then pressed upon the already structured rigid areas. Finally, the unstructured area beneath the flexible printed circuit board is milled away.

For manufacturing rigid-flexible boards, standard LPKF systems can be used. Flexible and rigid-flexible PCBs are easily manufactured in your own electronics lab by plotters of the LPKF ProtoMat S-Series and H-Series.

Flexible and Rigid-Flexible Board Examples
Polyimide can also be used as a laminate core in non-flex circuit applications. Recently DuPont leveraged its extensive dispersion technology to fill polyimides with organic and inorganic materials in order to achieve enhanced and/or unique properties. DuPont™ Interra™ HK laminates use this technology for the purpose of embedding planar capacitance in printed circuit boards. Because polyimide film does not contain any woven fabric reinforcement, there is no concern for conductive anodic filaments (CAF), no matter how thin the dielectric.
Another product that takes advantage of dispersion technology in polyimides is DuPont TC. For this material, thermally conductive fillers are used to enhance the transfer of heat through the laminate without significant loss in dielectric strength. Applications include heating and cooling elements for thermoelectric modules as well as insulated metal and direct bond substrates.
Polyimide laminate technology has been the foundation of the flex circuit industry for many years. With the introduction of adhesiveless laminates, the possible uses for flex circuits have greatly expanded. With the development of filled polyimide technology, DuPont is continuing to lay the groundwork for the continued use of polyimide laminates well into the future in new and exciting applications in a broad range of markets.

Copper weight: 1oz
Board thickness: 0.040″
Surface treatment: ENIG
Min.line width/space: 4/4mil
Min hole size: 8 mil

Product type: Rigid-Flex PCB
Layer count: 6 layers
Material: Polymide+FR4
Copper weight: 1/1oz
Board thickness: 0.063″
Surface treatment: ENIG
Min.line width/space: 8/8mil
Click to zoom in.

Our products are more and more used in telecommunications equipment, medical equipment, TV, DVD, watches, game consoles and other home appliances. Company now has a number of advanced circuit board production equipment, such as CNC drilling, copper sink, copper, tin plating automatic production line, exposure machine, fully automatic shooting machine shift, lead-free HASL, Immersion Gold, automatic electric materials; HAL, L / F HAL, OSP (Entek), Immersion gold / silver / tin, gold, finger and other surface treatment processes. with cables or connectors.

Depite the fact that rigid-flex PCBs cost higher than rigid PCBs, it is the more economical solution. Cost savings can be realized
with a lower number of components and lower assembly cost. Besides, the reliability of the final product will be increased as
well because of rigid-flexible pcbs.

Rigid-Flex PCB can be found in mobilecommunications, portable computers, computer peripherals, PDAs, digital cameras.

We have experience in producing rigid-flexible PCBs.

Please visit Rigid-Flex PCB to check our rigid-flex capability list light composites that integrate wiring in ultra-thin, flexible ribbons between sections. In rigid-flex packaging, a flexible circuit substrate provides a backbone of wiring with rigid multiplayer circuit sections built-up as modules where needed.
TTM produces flexible and rigid-flex circuits for commercial, aerospace and defense markets.
Type 1: Single sided flexible Rigid-Flex PCB

Rigid-flextechnology integrates flexible circuit technology into rigid board technology. The Group provides solutions to promptly tailor its rigid PCB, flexible circuit products and cover film materials to meet material with or without shield(s) or stiffener (one conductive layer).
Type 2: Double sided flexible material with or without shield(s) or stiffener (two conductor layers) with plated through holes.
Type 3: Multilayer flexible material with or without shield(s) or stiffener (more than two conductor layers) with plated through holes and HDI.
Type 4: Multilayer rigid and flexible material combinations (more than two conductor layers) with plated through holes and HDI.
Flex & Rigid Flex Features
1-30+ Layer Capability
IPC 6013 types 1,2,3, & 4
Complex balanced & unbalanced structures
MIL-SPEC & UL Qualified
Acrylic, Epoxy and Adhesiveless Polyimide
Silver film & sliver ink EMI shielding
Custom Surface Finishes Available
Flex Assembly Services
Customized Forming and Fitting on Flex

If the options of rigid-flex circuit boards are taken into consideration and coordinated at an early stage during the design, this technology offers many advantages:

3-dimensional wiring can miniaturize the need for space
Elimination of connectors and less laminate means less weight
Reduction of electrical joints ensures better reliability
Mounting is easier to deal with compared with pure flexible circuit boards alone
Even difficult contacts are detachable and thus simplify assembly
Testing conditions are simplified, a full test is possible prior to assembly
The expense of logistics and assembly is considerably lower with rigid-flex circuit boards
Flexibility
R=7, 120 Times/min, Movement distance 20mm
Bending 1 x 10' times, no fracture
Peel Strength (N/mm)
1.0
Solderability
160 °C/ 5Sec
300 °C / 10Sec
Insulation Resistance
> 500M Ω
Withstand Voltage
> 1000V/mm
A to Z Index

As a 2L FCCL that has excellent flexural and sliding characteristics at the small radius of curvature(0.65mm) used in cellular phones, HDD pick-ups multi-layer FPC, rigid flex, etc.
Single Layer
Double Layer

An FPCB laminate material used as an adhesive and insulating layer for glass fiber types and which does not generate impurities during the work process. Its application includes cellular phones, HDD pick-ups multi-layer FPC, rigid flex, etc.
DS-7408 BS(DF) / DS-7409 BS(DF) / DS-7402 BS(DF)

A reinforcing sheet that facilitates parts mounting on FPCB.

The trick to developing good inks seems to be to design a mechanism
for applying the desired conductive material in a form that retains
flexibility, adhesion, and good conductivity. There are a lot of
issues that determine the final conductivity of the deposited material.

Though it is hardly an original thought, what I would really like to
be able to do is apply conductive, resistive, and suitable dialectric
materials using an inkjet process on a variety of appropriate
substrate materials. The goal would be to create all of the 'glue'
components - bypass caps, resistors, traces and pads to minimize the
fabrication cost and/or effort for one off prototypes.
Related Industries
Semiconductor Packaging & Circuit Materials Pyralux® Flexible Laminates
DuPont™ Pyralux® flexible laminates are available in a broad range of copper clad constructions using a wide variety of base dielectrics. These laminates are available in either adhesive based or adhesiveless form.
Adhesive based clads, also known as 3-layer, are made using DuPont™ Kapton® and are available in sheet form with either Pyralux® FR or LF acrylic adhesive. Also available, under the Nikaflex® brand name, is an epoxy adhesive based 3-layer clad in roll form.
Adhesiveless clads, also known as 2-layer, are available either as double-sided using a lamination based manufacturing process or single sided utilizing cast technology.
Display Materials

Related Products
Interra™ embedded passive materials

MSDS/AIS Requests
Contact Us to Obtain Material Safety Data Sheets (MSDS) and Article Information Sheets (AIS)
Frequently Asked Questions
Get Answers Here!

Fl

Single-sided flexible circuits are the simplest and there for cheapest, consisting of a single conductor layer on a flexible dielectric film (see figure 1) with the option of a coverlay or semi flexible liquid photo imagable solder resist (for some flex & stay applications). Parts of the flexible can be made more rigid by the use of additional stiffeners.

Figure 1

Double sided flexible circuits consist of two copper layers with a dielectric layer in between (see figure 2) normally connected with plated through holes, with the option of coverlay’s or semi flexible liquid photo imagable solder resist (for some flex & stay applications). Parts of the flexible can be made more rigid by the use of additional stiffeners.
Products Showroom

2 layer rigid flex PCB, 1 flexible layer, immersion gold finish
3 layer rigid flex PCB, 2 flexible layer, immersion gold finish

4 layers rigid flex PCB, 1 flexible layer
Multilayer PCB Manufacturer China, PCB Prototype Model Factory, Quote/order 24 hour;

Contract manufacturing of pcb, Mass Production, FPC, Rogers Base PCB Supplier, PCB Outsourcing,

Multilayer PCB High Quality PCB, Low cost & Mass Production,Shenzhen,China/USA/UK/India

PCB Equipment
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Flex Circuit Manufacturer PCB Manufacturer China, PCB Manufacturing, Rapid Prototyping, Multilayer/AL MCPCB/FPC,Low cost production

PCB Manufacturer, quick turn Fast PCB Prototype, low cost High quality Bare PCB Contract Manufacturing, Multilayer // double side //FPC, High Density precision PCB, Impedance control PCB, Buried & Blind Via, Gold Finger, Lead free/ROHS/UL;
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Material: FR4, High TG FR4, Rogers 4003,4350,Al Aluminum metal base,Taconic,Halogen Free material, CEM-3,Fr2,CEM-1,CEM-2,94VO, Rogers HF material, Polymide,Flexible PCB FPC etc. UL certification, quote & order 24 hour;

Customer Service Guideline for PCB factory line:
Quick response, Professional Service & Strive for the best.
Flexible PCB (FPC) and Rigid PCB Sample or mass production.

PCB fast Prototype output varieties: 3000 types per month

PCB output volume: 100,000 suqare feet per month

Quick turn / fast Prototype service:

Customer allover North America (USA - United States, Canada), Europe(UK - United Kingdom. England, France, The Netherlands, Spain, Austria), India...

The quickest Prototype lead time for 2-layer PCB: 24 hours
The quickest Prototype lead time for 4-8 layers PCB: 48 hours
The quickest Prototype lead time for 10 layers PCB or above: 120 hours

High Density PCB, Impedance control PCB, Buried & Blind Via, Gold Finger PCB,
Gold Plating PCB,Immersion Golde surface, HASL surface.Heavy Copper PCB,
Rogers PCB,Rigid Flex PCB, Teflon PCB, Halogen Free PCB, High TG PCB(High Temperature PCB), HF PCB(High Frequency PCB);
Aluminum PCB(Metal Base PCB)

For furhter information, please feel free to contact us,quote & order 24 hour.
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Flex PCB Material,Flex PCB Manufacturer China, manufacture

Flex PCB Material,Flex PCB Manufacturer China, manufacture Types of Flexible & Flexi-Rigid PCB’s Pyralux, offering of materials used to make circuitry in a wide variety of applications

Flex PCB Material,Flex PCB Manufacturer China, manufacture

electronics market PCB assembly

Flex PCB Material,Flex PCB Manufacturer China, manufacture

Types of Flexible & Flexi-Rigid PCB’s Pyralux,

offering of materials used to make circuitry in a wide variety of applications