The Cadence Designer Network User Group Community HomeSilicon Valley 2007 presents the Spectre RF noise-aware PLL flow Read more ? ... by mcatramb91 Trykon is 100% correct on the ...> PCB Design ...DESIGN FOR MANUFACTURING

Cadence design for manufacturing (DFM) technologies enable you to verify and optimize layouts in digital and custom IC designs, while providing a reliable way to achieve manufacturing sign-off before tape-out.

To successfully get nanometer-scale designs to market, semiconductor companies must address a growing array of challenges—from ever-more stringent design rules to increasing chip layout complexity. Designers must also contend with the physical effects that become much more troublesome at these smaller geometries. Lithographical and CMP manufacturing effects can have significant impact on both functional and parametric yield. Process variations across the die, wafer, and batch affect yield, performance, and reliability.

Cadence recognizes these challenges and has created the most comprehensive Design for Manufacturing (DFM) solutions in the industry. Cadence technologies are integrated into design flows to prevent manufacturing effects from impacting digital and custom layouts, analyze systematic and random variability on designs and optimize the design to maximize yield. In minimizing the impact of random and systematic manufacturing effects on functional and parametric yield, Cadence provides designers with the technologies and flows they need to address the industry's most difficult DFM challenges.

www.cdnusers.org/ - 78k - Cached - Similar pages

PCB Design Conference East 2008 - May 11 - 16, 2008, Tinley Park, IL***Please note that this is the conference program for PCB East 2007 and is being given as a point of ..... S13 – RF/Microwave and Mixed-Signal PCB Design ...
www.pcbeast.com/conf/technical.html - 95k - Cached - Similar pages

CADSTAR - PCB Design SuiteThe CADSTAR PCB Design Editor offers a powerful editing suite for your most ... Z-DAC 2007 - Zuken's Annual Conference - see Zuken.com for more information ...
www.cadstarworld.com/products_pcb.asp - 29k - Cached - Similar pages

PCB Design | PCB Layout | Circuitblog"PCB Austin", 3 Day Circuit Board Design Conference in March .... sales@circuitpac.com | Customer Service 972-233-6688 // service@circuitpac.com ...
www.circuitpac.com/PCB-Design-Resource - 81k - Cached - Similar pages

Cadence Improves Allegro PCB Technology for RF Printed-Circuit ...Cadence has added RF technology and design methodology to its Alegro PCB Design ... just concluded Design Automation Conference the addition of PCB (Printed ...
www.edadesignline.com/products/199905326 - 44k - Cached - Similar pages

[PDF] A PCB design approach for best EMCFile Format: PDF/Adobe Acrobat - View as HTML
A PCB design approach for best EMC. Slide 2. Introduction. Tim Jarvis. BSc CEng MIEE MIEEE. RF /Analogue Engineer. Since graduating in 1983 ...
www.ieee.org.uk/docs/emc0604a.pdf - Similar pages

PCB Design Conference West 2008 - September 14 - 19, 2008 - Santa ...PCB Design Conference West is the premier conference and exhibition for PCB ... control of signal integrity and control of EMI, in both digital and RF PCBs. ...
www.pcbwest.com/conf/bios.html - 37k - Cached - Similar pages

Course details | Oxford University Department for Continuing EducationThis intensive one-day course provides a thorough introduction to the principles of RF PCB design techniques in an intuitive and practical way. ...
www.conted.ox.ac.uk/courses/details.php?id=O06C804H6J - 13k - Cached - Similar pages

MotionNET.com - PC Boards: PC Board Design Service DirectoryPCB design and layout service. Photoplotting services also. ... Quality PCB Layout Services for Finepitch, BGA and RF to 2.5GHz. ...
www.motionnet.com/cgi-bin/search.exe?a=cat&no=3020 - 39k - Cached - Similar pages

Mentor Introduces PADS2007 for Windows-based PCB Design ~ EDA GeekPADS is the Windows(R)-based standard for PCB design solutions, combining value ... Mentor Graphics Keynotes International System-on-Chip Design Conference ... Hunter Technology To Introduce Carbon Composite Printed Circuit Boards At Embedded Systems Conference

Hunter Technology, Santa Clara, CA announced that it will exhibit its STABLCOR?board manufacturing capabilities at this year抯 annual Embedded Systems Conference Silicon Valley (http://www.embedded.com/esc/sv/), running April 3-7, 2006 at San Jose抯 McEnery Convention Center. Visit Hunter Technology at Booth #5039, at North America抯 largest electronic systems design event for electronics engineering抯 creators of technology. STABLCOR?Carbon Composite imbedded Printed Circuit Boards provide extremely high thermal transfer rates and controlled XY Coefficient of Thermal Expansion to match ceramic, or silicon direct chip attach applications with no added Z axis expansion over FR4 or Polyimide.

Hunter抯 STABLCOR?Printed Circuit Boards also have extreme rigidity and are much lighter weight than boards using CIC or Heavy Copper core for thermal transfer capabilities. Hunter has the ability to manufacture these technically superior boards with FR4, Polyimide, Rogers, RF and mixed materials in a layer counts ranging from 4 layers to over 40 layers. Hunter Technology strives to provide OEM抯 with the competitive advantages which can be realized by working with a truly integrated one-stop electronic manufacturing service provider.

揟he Embedded Systems Conference offer抯 us a unique opportunity to meet face to face with some of the worlds best and brightest Engineering talent. Nearly all of today抯 Embedded Systems solutions are faced with serious thermal and reliability challenges. Hunter's one stop solution of PCB Design, Fabrication and Assembly incorporates the benefits of STABLCOR?throughout the Embedded System Solution.?stated Joseph O'Neil, President of Hunter Technology.

The five-day Embedded Systems Conference this year returns to the heart of Silicon Valley, and will showcase the latest developments in enabling technologies, systems and software products, and tools created by the electronics industry抯 most innovative minds ?the Creators of Technology. ESC will welcome over 300 leading exhibitors and feature more than 194 classes and design seminars to give engineers and engineering managers thorough training and understanding of the industry抯 most critical themes ?like analog and power, Linux and DSP, Consumer Video, and Wireless Networking. Conference highlights include a comprehensive technical program and series of design seminars, an exhibit show floor featuring the industry抯 top players, a keynote address by inventor and education advocate Dean Kamen, the second Annual Creativity in Electronics (ACE) Awards, and the return of the popular Microprocessor Summit.

About Hunter Technology Corporation

Hunter Technology Corporation http://www.hunterpcb.com, an electronics contract manufacturer offering printed circuit board design, layout, fabrication, assembly and test services to OEM抯 requiring high reliability and built in quality, competitive prices and time-sensitivity. The Company offers high layer count, fine line fabrication and assembly of technologies ranging from high speed press-fit connectors to microBGA抯. Hunter抯 quick turn capabilities from prototype through production, extensive experience in advanced materials, combined with the strengths of its design through functional test capabilities, ensure its Customers a unique competitive edge.

Contact: Dave Roberson Hunter Technology Corporation davidr@hunterpcb.com (408) 245-5400 This intensive one-day course provides a thorough introduction to the principles of RF PCB design techniques in an intuitive and practical way.
To top
Description
Modern RF and wireless product design is a highly complex engineering task and the design and layout of the PCB is critical to success. The PCB often contains circuits with conflicting requirements - for example extremely sensitive analogue stages such as RF receivers alongside extremely noisy blocks such as digital processors. The performance of RF components and the PCB substrate also set boundaries on what can be achieved in modern designs. This intensive one-day course provides a thorough introduction to the principles of RF PCB design techniques in an intuitive and practical way. Full course contents available here
To top
Staff
Mr Tony Richards
Role: Presenter

Tony Richards is a Senior Technical Consultant with Plextek Ltd. He was recruited for his experience in analogue and RF IC design and has since worked on several single chip radio system developments for multinational silicon vendors such as National Semiconductors, Sony Semiconductors and Frontier Silicon. Tony has also worked on the development of wireless meter readings systems, WLAN PC cards, Bluetooth hands-free car-kits and inductive tagging systems for livestock. Most recently he has been developing a short-range proximity detection system based on inductive coupling. Prior to joining Plextek Tony was technical project leader with Philips Consumer Communications, responsible for developing highly integrated digital receiver ICs. In 1989 he helped design Philips' first commercially available single chip direct conversion digital paging receiver. He also worked for Philips Research Labs in Eindhoven and for Philips Radio Communications Systems of Cambridge. Tony graduated from Loughborough University of Technology in 1977 with a BSc in Electrical & Electronic Engineering in 1977.

Mr Steve Williamson
Role: Presenter

Steve Williamson is Principal RF Design Engineer at Anritsu MMD-E Ltd and has extensive experience in RF design and microwave design. Prior to this he was a Senior Technical Consultant in the RF Integration Group at Plextek Ltd. Steve's work covers the whole range of the RF and microwave design spectrum, with particular involvement in the design of VCOs and synthesisers. He has also worked on the development of various custom communication systems, several RFIC and MMIC designs and other projects including a multi-band GSM test set. After graduating from Southampton University with a BEng(Hons) in Electronic Engineering, where he was sponsored by Marconi Radar Systems (Chelmsford), Steve returned to Marconi to become a member of their Microwave Design Team. Subsequent to this, Steve joined the RF Design Group at Philips - PMR (Cambridge) in 1995. Here he was involved in the design of the frequency generation used in the first TETRA handsets and base stations.Circuitblog - PCB design information and commentary for Managers, Engineers and Designers
Circuit Board Design News and Views
Current Posts | RSS Feed

Design for Fabrication - SMT
Posted by Rick Austin on Mon, Jan 21, 2008 @ 06:52 AM
Email Article | digg it | reddit | del.icio.us | StumbleUpon
Step 1: Left Shift the Bottom Line
by Steve Hughes, Mentor Graphics
SMT Magazine - January 2008 Pages 17-18
"It's documented that using "Design for Fabrication" (DFF) techniques for PCB design produces higher yield and lower cost. The real question is how. After taking a brief look at the problem, the "how" steps are enumerated in the left-shift methodology."

0 Comments

Tags: pcb design, design for manufacturing, DFF

BGA Breakouts and Routing - PCD&F
Posted by Rick Austin on Tue, Jan 15, 2008 @ 02:16 PM
Email Article | digg it | reddit | del.icio.us | StumbleUpon
BGA Breakouts and Routing
BGA miniaturization amplifies the design challenge of balancing high-performance signal integrity with fabrication cost reduction.
Written by Charles Pfeil, Mentor Graphics
Posted: 01 January 2008

0 Comments

Tags: BGA, design for manufacturing, routing, signal integrity, SI

2008 PCB Technology Leadership Awards
Posted by Rick Austin on Fri, Jan 11, 2008 @ 10:00 AM
Email Article | digg it | reddit | del.icio.us | StumbleUpon
Mentor Graphics announces 20th Annual PCB Technology Leadership Awards Program

Mentor Graphics Corporation (Nasdaq: MENT) announced the call-for-entries of its 20th annual Technology Leadership Awards competition, continuing its tradition of recognizing excellence in printed circuit board (PCB) design. Started in 1988, this program is the longest running competition of its kind in the electronic design automation (EDA) industry. It recognizes engineers and computer aided design (CAD) designers who use Mentor's innovative technology to address today's complex PCB systems design challenges and produce industry-leading products.

Prominent experts in the PCB industry will judge the contest, including Happy Holden, senior technology specialist of Mentor Graphics; Gary Ferrari, technical support director, FTG Circuits; Pete Waddell, vice president of UP Media, publisher of Printed Circuit Designs & Fabrication Magazine; and Rick Hartley, senior principal engineer, avionics division of L-3 Communications.

"I'm pleased to see Mentor's continued support for this program," stated Gary Ferrari. "PCB designers are constantly facing new challenges and finding innovative solutions to address them. The Technology Leadership Awards are a great way to showcase the leading-edge design approaches they're utilizing, and recognize the designers and their contribution to the PCB industry."

This year, entrants will be able to submit their design accomplishments in any of six categories representing a wide variety of industries:

* PC computers and peripherals
* Consumer electronics and handhelds
* Industrial control, instrumentation, security and medical
* Military and aerospace
* Telecom switches, network servers, base stations and computer mainframes
* Transportation and automotive

"Mentor Graphics is committed to the PCB systems design community, and our PCB Technology Leadership Awards contest provides the opportunity to showcase the most innovative and talented designers worldwide," said Henry Potts, vice president and general manager, systems design division, Mentor Graphics. "The program continues to attract the most skilled users of our PCB systems design tools and Mentor expects this year's competition to be bigger than ever with entries from virtually all the major electronics countries in the world."

Winners will be named for each category as well as a Best Overall Design. The timeframe for submitting entries is from January 10th through March 14, 2008. Entrants can apply online at www.mentor.com/go/tla.

About the Technology Leadership Awards Contest

Mentor's Technology Leadership Award contest is open to any designs created with Mentor's PCB solutions, including the Board Station?, Expedition(tm) Enterprise and PADS? design flows. Judging will be based on overcoming complexity challenges, such as small form factor, high-speed content, design team collaboration, advanced PCB fabrication technologies and design-cycle time reduction. Judging will start in mid-March and winners will be announced at the PCB Design Conference East, Tinley Park, IL in May 11-16, 2008.

About Mentor Graphics

Mentor Graphics Corporation (Nasdaq: MENT) is a world leader in electronic hardware and software design solutions, providing products, consulting services and award-winning support for the world's most successful electronics and semiconductor companies. Established in 1981, the company reported revenues over the last 12 months of over $825 million and employs approximately 4,300 people worldwide. Corporate headquarters are located at 8005 S.W. Boeckman Road, Wilsonville, Oregon 97070-7777. World Wide Web site: www.mentor.com.

Mentor Graphics, Board Station and PADS are registered trademarks and Expedition is a trademark of Mentor Graphics Corporation. All other company or product names are the registered trademarks or trademarks of their respective owners.

0 Comments

Tags: pcb design, competition

Eliminating EMI protection components
Posted by Rick Austin on Mon, Jan 07, 2008 @ 01:55 PM
Email Article | digg it | reddit | del.icio.us | StumbleUpon
Eliminating EMI protection components
Use of the faraday cage or "picket fence" approach to PCB design and layout to eliminate costly EMI protection components.
Industrial Control Designline
By David Petry, ZMD America Inc.
Posted: 12/31/2007

0 Comments

Tags: EMI, pcb design

Factors to consider when evaluating a PCB design tool
Posted by Rick Austin on Wed, Jan 02, 2008 @ 10:45 AM
Email Article | digg it | reddit | del.icio.us | StumbleUpon
Addressing EMI test challenges in high-density interconnect PCB design
Electronics Supply & Manufacturing - USA
By Sylvia Teo, Mentor Graphics
Posted: Dec 24, 2007

"As engineers, you need to incorporate advanced technologies into products to make them superior in functionality or optimized for product cost. The challenge lies in how to efficiently implement these technologies into the products while considering factors such as time-to-market, design features, testing and EMI conformity.

This article discusses how to address the challenges in PCB design and what factors should be considered when evaluating a PCB design tool."

0 Comments

Tags: design, high density, HDI, signal integrity, SI, RF, flex, packaging, tools

Tools ease switch to CADSTAR
Posted by Rick Austin on Wed, Dec 26, 2007 @ 01:00 PM
Email Article | digg it | reddit | del.icio.us | StumbleUpon
Tools ease switch to CADSTAR
Electronics Talk (press release) - UK, December 19, 2007
Migration tools enable designers to move schematics, libraries and PCB designs from Cadence Allegro and Orcad, Mentor Graphics PADS PCB and Altium Protel and P-CAD to Zuken CADSTAR.

0 Comments

Tags: Mentor, PADS, Altium, software, Zuken, CADSTAR, Cadence, Allegro

"PCB Austin", 3 Day Circuit Board Design Conference in March
Posted by Rick Austin on Thu, Dec 20, 2007 @ 07:21 PM
Email Article | digg it | reddit | del.icio.us | StumbleUpon
PCB Austin to Debut in March
Tuesday, 18 December 2007

SMYRNA, GA - PCB Austin, a new three-day technical conference, will be held March 4-6, 2008, in Round Rock, TX. The host facility for PCB Austin will be the Wingate by Wyndham & Conference Center. PCB Austin 2008 will include three days of conference courses, a one-day tabletop exhibit on Wednesday, March 5 from 12 noon - 7 pm, and networking events.

PCB Austin is an addition to the UPMG portfolio of shows, which includes PCB East and PCB West. In a statement, President Pete Waddell said, "We've produced the PCB Design Conferences since 1992, but now see a need to expand our portfolio to include regional events in key areas throughout North America."

0 Comments

Tags: Events, pcb design, conference, Austin

First product to use 0201 diodes and 01005 passives?
Posted by Rick Austin on Wed, Dec 19, 2007 @ 01:55 PM
Email Article | digg it | reddit | del.icio.us | StumbleUpon
iSuppli's analysis of the iPod Touch - an interesting article about miniaturization and packaging.

"To cut space usage, the iPod touch makes use of some advanced packaging..., including 0201 diodes and passive components in 01005 enclosures on the touch’s WLAN module. 'This is the first time iSuppli has seen these components in a product we’ve torn down.'"

Jonathan Cassell, iSuppli
Posted: Dec 19, 2007

0 Comments

Tags: high density, miniaturization, packaging

The 2007 PCB Designer Salary Survey - PCD&F
Posted by Rick Austin on Tue, Dec 18, 2007 @ 03:07 PM
Email Article | digg it | reddit | del.icio.us | StumbleUpon
The 2007 PCB Designer Salary Survey
The survey suggests the U.S. designer resource is aging at an excellerated rate, so we need to ask, "Where is the next generation of PCB designers?"
by Kathy Nargi-Toth
Posted: 1 Dec 2007

0 Comments

Tags: designers

Signal Integrity and PCB Layout Considerations for DDR2-800 Mb/s and DDR3 Memory Systems
Posted by Rick Austin on Tue, Dec 11, 2007 @ 03:14 PM
Email Article | digg it | reddit | del.icio.us | StumbleUpon
Signal Integrity and PCB Layout Considerations for DDR2-800 Mb/s and DDR3 Memory Systems (link to abstact and downloadable pdf)
This paper, chosen as the People's Choice Award for Silicon-package-board at CDNLive! Silicon Valley 2007, addresses the problem of meeting signal and power integrity requirements of PCBs containing Double Data Rate (DDR) memories. The emphasis is on low layer count PCBs, typically 4-6 layers using conventional technology.
Conference Program: Classes

***Please note that this is the conference program for PCB East 2007 and is being given as a point of reference for the types of courses presented at the PCB Design Conferences. Please check this site at a later date to see the 2008 conference program.

Conference Intro | Conference Program | Speaker Bios

Sunday and Monday | Sunday | Monday and Tuesday | Monday | FREE Tuesday | Wednesday | Thursday | Friday

SUNDAY AND MONDAY, OCTOBER 21 - 22

Sunday AND Monday, October 21 - 22, 9 am – 5 pm
DEC 1 – PCB Design 101
Speakers: Gary Ferrari, Firan Technology Group; and Susy Webb, Fairfield Industries
Attendees: Entry-level PCB designers and anyone else interested in an introduction to PCB design.

Managers often ask, “Where can I send my entry-level designers to learn the tricks of the trade?” This tutorial is the answer! Technical sessions at conferences often emphasize the latest techniques and technologies, but unfortunately, those classes are usually too in-depth for the typical novice designer. This class is targeted at the entry-level PCB designer or someone just starting out in this profession. Class will begin with the components and the schematic, and continue through layout and post-processing. Attendees will learn how to interpret component specification sheets and schematics, how to plan component placement, as well as routing strategies, DFM, DFT, post-processing and more.

NEW!
Sunday AND Monday, October 21 - 22, 9 am – 5 pm
DEC 2 – Impact of Lead-Free on PCB Design and DFM/A
Speakers: Gary Ferrari, Firan Technology Group; Doug Sober, Kaneka Texas Corp.; Chrys Shea and David Ormerod, Cookson Electronics Assembly Materials

The dynamics of materials changes and critical assembly considerations for designing RoHS compliant PCBs will be covered in this two-day course. Industry experts from across the supply chain will provide information on base materials considerations for RoHS, final finish selection and assembly issues that have resulted from the change to lead-free solder pastes and wave soldering. The program beings with an introduction to lead-free design by Gary Ferrari. This overview will provide the attendee with an understanding of the manufacturing and assembly challenges that have resulted from RoHS and lead-free PCB assembly.

The second topic covered will be material selection for RoHS by Doug Sober. One of the most difficult areas for the designer, as well as the fabricator, has been RoHS-compatible material selection. With the increased soldering temperatures and extending contact times, materials do not behave as expected according to the slash sheets. This presentation will provide practical guidelines for the selection and qualification of laminate materials used in RoHS compliant PCBs.

The session on final finish compatibly for RoHS assembly presented by David Ormerod will provide the attendee with insight into the commonly used final finishes and their typical application based on board type and assembly specifics. Final finishes will be compared for their compatibility with RoHS assembly. The attendee will learn what can be expected from the various final finishes based on design complexity, material type, board thickness and the specific assembly process.

Chrys Shea and David Ormerod will present information on the influence of final finish selection on assembly processing, reviewing both the operational and financial advantages or disadvantages of the various final finish options. A key element to successful RoHS assembly is following revised DFA protocols. Design guidelines for SMT include the impact of micro via-in-pad, methods to minimize voiding when employing this design feature, optimizing stencil design for high yields, and up-to-date research on both metallization/via filling fabrication technologies and mixed metals BGA assembly technologies. Design practices for wave soldering will cover the impact of lead free on the assembly process, assembly considerations for thick panels and high layer counts, ways to improve hole fill and reduce solder bridging, and the effects of copper erosion during the soldering process. The data will provide attendees with useful design guidelines to aid in the reduction or prevention of defects in the assembly process.

SUNDAY, OCTOBER 21

NEW!
Sunday, October 21, 9 am - 5 pm
T1 - Control of EMI and Crosstalk
Speaker: Rick Hartley, L-3 Communications, Avionics Systems Inc.
Attendees: Circuit design engineers, PCB designers and managers interested in learning what to do at the PCB and circuit to control EMI.

The Problem!
When a time-varying (AC) current flows, an electric field and a magnetic field are present. These fields, when not controlled, are the cause of EMI and crosstalk. In recent years, the effects of these fields has increased dramatically in digital circuits due to ICs with very fast rise and fall times. A device with a 500 ps rising edge will likely have a 16 times greater opportunity to generate EMI than one with a 2.0 ns rising edge.

The Solution!
An emanating electromagnetic field will travel outward from the source until captured by its 180 degree compliment. The most effective place to capture and take control of these fields is with proper PCB design. Gaining an understanding of what generates these fields and how to control and contain them, and their effects, will take EMI and crosstalk control from "guess work" to basic "everyday practice.”

This course is a crisp focus on the issues PCB designers and engineers need to know. It will cover the following: basic circuit and PCB properties, where high speed currents actually flow, why EMI and crosstalk are on the rise, types of EMI, source control of EMI, correct power distribution and decoupling, correct component positions, cables and other EMI radiators, divided planes and plane islands in the PCB, correct position of signal routes, correct stacking of the PCB, cause and control of signal crosstalk and effect of guard traces, component selection, board size and connector placement, connector pin assignments, filtering and blocking techniques, three approaches to system RF shielding and grounding, plastic vs. metal cabinets and enclosures, and slots and openings in enclosures.

Sunday, October 21, 9 am - 5 pm
T2 - Design Challenges with HDI/Microvias, Including Hands-On Design
Speakers: Happy Holden, Mentor Graphics, and Mike Fitts, Plexus
Attendees: PCB engineers, designers, managers and others interested in using HDI/microvias.

Part 1 of this course will examine design techniques for the interconnection of area array components from ASIC packaging, portable products, high-performance computing and telecom to dense multichip modules. PCB design rules, materials and selection of PWB structures (blind, buried and microvias) will be examined and compared. The tutorial will define the buried passive technologies, distributed capacitance, HDI technologies, circuit routing guidelines and materials required to permit the use of widely accepted fine-pitch and BGA components. One millimeter, 0.8 mm, 0.65 mm and 0.5 mm fine-pitch components are the focus of pad, spacing and layer assignments. Channel routing techniques using blind vias will show how layers can be reduced by as much as 3X, with the associated cost reductions. Examples will be the 1,247 and 2,577 I/O 1.0 mm CCGAs. Participants are encouraged to bring technical questions for discussion.

Part 2 of this course is a hands-on session. It will take the principles learned in earlier in the course and apply them to real-world designs. Part 2 will begin with a discussion of CAD tool sets and include the use of an actual tool set to strengthen the understanding of how HDI can be used to solve everyday design challenges. Previous tool set experience is required, and the ability to work as part of a team is mandatory.

MONDAY AND TUESDAY, OCTOBER 22 - 23

NEW!
Monday and Tuesday, October 22 – 23, 9 am - 5 pm
DEC 3 – High-Speed Design
Speaker: Lee Ritchey, Speeding Edge

This class will cover the design of high-speed PCBs and their associated systems. It covers all the physics involved in high-speed design, explaining the science behind each one of the principles, their role in high-speed systems and how to properly manage the design process to account for them. This course will give the engineering professional the fundamental knowledge necessary to make the most efficient design rule set, organize the design process to efficiently execute the design, select the appropriate PCB materials and choose the toolsets that will best suit the design process. This course is especially relevant to IC designers as device speeds outstrip the traditional packages and application notes.

MONDAY, OCTOBER 22

Monday, October 22, 9 - 11 am
W1 - PCB Base Materials for Lead-Free, High-Speed and High-Frequency Applications
Speaker: Rick Hartley, L-3 Communications, Avionics Systems
Attendees: PCB designers, circuit design engineers, systems engineers and managers needing to know when to use FR4 and when to use one of the various high-speed materials in high-frequency circuits, as well as the effect the various materials have on lead-free assembly.

In a high-speed or high-frequency circuit, performance is dependent upon a number of characteristics and variables. They all accumulate to affect the noise budget of the circuit. Several of these issues are driven by the PCB’s base material characteristics. At high frequencies, materials can and do have a profound impact on performance.

This course will discuss the base materials commonly used in high-speed digital and high-frequency analog circuits (including FR4), looking at their advantages and disadvantages. It will also detail how to calculate their impact on circuit performance, hence how to choose a cost-effective material for any specific application. The course will also look at how each of these materials fits into today's lead-free products.

NEW!
Monday, October 22, 9 - 11 am
W2 - Implementing Advanced Technologies: How to Achieve Success within Your Organization
Speaker: Mike Fitts, Plexus

You've been doing your homework and thoroughly investigating a technology that has never been used at your company. You have gotten to the point of believing that the technology has some real merit. Now what? How do you get anyone to listen to you and take you seriously when you begin suggesting that your company should consider its use? How do you go about "selling" this technology within your company?

Anyone who has been successful at "bringing a new technology into a company" knows the challenges associated with what typically is a long, drawn-out process of getting buy-in for a new technology. This class has been put together to provide attendees with the knowledge to help achieve buy-in from their internal organizations as they move to implement an identified advanced technology. We will focus on identifying who the various stakeholders within your organization are and how to "sell" to them. We will discuss how to organize your internal "sale" and look at the typical "collateral" needed to be successful.

NEW!
Monday, October 22, 9 am – 12:30 pm
S1 - Embedded Passive Component Technology Available Now
Speaker: Richard Snogren, Bristlecone LLC
Attendees: Anyone interested in embedded passives but unfamiliar with EP technology.

This half-day course is a review of the state-of-the-art of today’s commercially available embedded passive component materials technology. The course starts with passive component functions and performance drivers to embed passives. This leads into an in-depth discussion of today’s commercial material sets; their electrical and physical characteristics; a useable selection rationale; design, test, and trim tools; and DFM guidelines for implementation. The presentation includes discussion of the relative costs of the various technologies and a methodology for cost analysis. The class concludes with a review of industry initiatives on embedded passive components. What you will learn: Why and when to embed resistor and capacitors; commercially available material sets; design guidelines and manufacturing processes; and embedded passive component industry initiatives.

Monday, October 22, 1:30 – 3:30 pm
W3 - Designing for Asian Fabrication
Speaker: Happy Holden, Mentor Graphics
Attendees: PCB designers, design managers, layout technicians and others interested in this topic.

If there were ever a time to have a full understanding of DFM, then having your boards built in China is that time! This workshop will highlight the issues, choices, alternatives and conditions that designers need to consider in order to make a printed circuit board manufacturable in Asia, especially China. Attendees will learn how to determine if a fabricator is capable of handling an order; how to use IPC-9151 capability benchmarking to select fabricators; when to control impedance; plating, finishes and thickness distribution; mechanical and image tolerances; materials, multilayer stackup and hole plugging; thieving, plating concerns and why plating thickness varies; calculations vs. 2D field solvers; and much more.

NEW!
Monday, October 22, 1:30 pm – 5 pm
S2 - Printed Circuit Design Utilizing Embedded Passives
Speaker: Rick Hartley, L-3 Communications, Avionics Systems
Attendees: PCB designers, design engineers, systems engineers, technicians and managers interested in learning how to design PCBs with embedded resistors and capacitors.

How to design with embedded passives has not been covered well for CAD systems not designed to work with components on inner layers. This course will discuss practical, easy to use information for designing PCBs with embedded devices using any CAD system. We will also cover the electrical performance, EMI and signal integrity benefits of embedded passive technology.

The course will cover the basics of how embedded passives are produced (both additive and subtractive processes), advantages not often discussed, when to use and when not to use embedded passives, realistic tolerances, calculating values, basic design flow, handling embedded devices in the schematic, designing the device footprint, placement and routing of embedded passives, balancing the PCB, DRC, and CAD output file generation and documentation.