basic printed circuit board design guidelines
1. High frequency pcb design requires
careful grounding. Use ground plane for control circuit.
Try to make most of signal ground connections through vias
to this ground plane rather then through PC traces.
2. For each power supply stage, keep power
ground and control ground separately. Tight them together
[If they are electrically connected] in one point near DC
output return of the given stage.
3. Minimize areas and lengths of loops
which contain high frequency switching currents.
4. Place capacitors that bypass supply
voltage and reference pins of all ICs close to these pins
5. Place filter capacitors so that their
terminals physically go right into the printed circuit board
traces that carry mainstream of the current to be filtered.
6. When doing PCB layout try to use symmetrical
routing for paralleled power devices.
7. Choose the width of circuit board traces
based on the rated current and acceptable temperature rise.
Make sure however that the PC trace will not fuse at any
abnormal current (such as short circuit current) that could
develop in the circuit.
8. PWB creepage and clearance between
primary circuits, secondary circuits and safety ground should
be determined according to the requirements of applicable
standards. For example, in a typical commercial application
with 120-230 VAC input, creepage between primary and secondary
circuitry per UL 60950 or IEC 60950 should be 6.4 mm min.
The main generic standard for PCB design
is currently IPC-2221A (the old standard was IPC D-275).
Quality and inspection issues for Rigid Printed Boards are
covered by Qualification and Performance Specification IPC-6012B.TaiQi
Technology
As a professional EDA design company,
TaiQi High Speed PCB Design Co., Ltd is specialized in high
speed PCB design, simulation analysis and plate EMC design.
100% of TaiQi staffs are bachelor degree holders and over
have more than 3years' experience in PCB design, among which
there are one EDA managers and many key engineer in one
very famous networking products company in China.As necessary
requirement, every staff concerned about design is skilled
in EDA techniques, high speed PCB design, plate EMC design,
DFM and thermal design.They good at networking products
, communication products , the main board of computer ,
display card ,etc. A large quantity of PCB products we participated
in design have been running in ethernet network, digital
communication and wireless communications etc. Accumulative
sales volume is up to billions yuan.
Solid technological foundation, successful experience, fast
delivery cycle, fast reaction speed and strict security
system, can offer door-to- door service thoughtfully , can
research and develop deficiency of personnel , research
and develop for your company cycle urgent one survive pressure
to share, bring the fast , biggest , safest interests most
to the customer and cooperative partner! . Highest speed
signal 3.125G difference modes
Highest layers: 28
Max Connections: 18564
Max PIN count: 26756
Min via: 8MIL (4MIL laser holes)
Min line width: 3MIL
Min line spacing: 4MIL
Min BGA PIN spacing: 0.5mm
Max BGA count in single PCB:30
Max Board area
Design Process
v Scope Of Application v
network products
v Main technology we have v
Plate EMC design
v business scope v
High-Speed PCB Design
High speed, high density, digital &
analog mixed PCB design for electronics and communication
products;
PCB design using new techniques (HDI and buried blind via
etc.);
Contacting service in PCB manufacture and soldering process.
Signal integrality analysis design
single board SI solutions; offer emulation
analysis service for systematic single board SI; SI test,
problems analysis and countermeasure;
EMI Analysis&Design
EMI design solutions, test, problem analysis
and countermeasure.
Thermal Design
confirming high consumption device placement;
Thermal problem analysis and design;
High-Speed Design Training
Training in EDA software
Training in Signal Integrity Design
Training in EMI Design
Training in Power Integrity Design
Training in Heat Design High-Speed PCB Design
High speed, high density, digital & analog mixed PCB
design for electronics and communication products;
PCB design using new techniques (HDI and buried blind via
etc.);
Welcome to develop the products cooperatively with you;
Signal integrality analysis design
Offer systematic single board SI solutions; offer emulation
analysis service for systematic single board SI; SI test,
problems analysis and countermeasure;
EMI Analysis&Design
EMI design solutions, test, problem analysis and countermeasure.
Thermal Design
confirming high consumption device placement; Thermal problem
analysis and design;
High-Speed Design Training
Training in software: various series of EDA software (PowerPcb
Cadence.) basic application and advanced skills, case analysis;
Training in Signal Integrity: refection, crosstalk, time
sequence, topological structure, layer construction analysis,
impedance control, application of emulation analysis software;
Training in EMC: EMC basic theory, EMC design for electronics,
EMC design for PCB, emulation analysis of EMC, typical case
analysis;
Training in Power Integrity capacitor select capacitor place
capacitor number power plate and groud plate distribute
typical case analysis;
Training in Thermal confirming high consumption device placement;
Thermal problem analysis and design(how many fans need and
how to place the fans);. Trade Leads
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largest company of PCB design and copy board! To copy board,
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PCB Range of design service
Various mainboards of high-end computers, Board card, Server
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2 Various control board, Board card;
3 High-end network routers, motherboards of fiber network
switch;
4 Digital television, DVR, STB, LCD driving mainboard;
5 Various wireless base station and motherboard of terminal
products;
6 Motherboards of high-precision instrument and equipment;
Reference of Design Cycle:
General mainboard of computer: 15 days; general board cards
of computer: 5 days;
2 Server mainboard: 15 days or so
3 Motherboard of wireless base station: About one month
5 High-end DVR: About 5days to a half month;
6 High-precision control board: About
7 General mainboard of monitoring equipments and board card:
15 days or so;
(The above schedule is for reference only; accurate time
is decided by specific state!)
Our advantages
Short-term project Besides the PCB design experience, our
design team also has high level manufacturing background;
Design-for-manufacturing will enable us to do one-time success
requirements and manufacturing limits, optimizing design
scheme directly save your time and money.
4 Strong technical support We could share group materials
and researching results of manufacturing members in respective
areas. Let me take it down from the acquired latest information.
Provide more values and information for our customers.
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Address:Suite906, TowerA, HanrongBuilding, NO.50ZhichunRD,
Haidian District , Beijing
Zip: 100098
Tel 010-82822680 82822616 82822822
Fax 010-82822822
Website http://www.bjdm.net
East China Headquarter
