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Business. Skip navigation ... Novel measurement circuit
eases batterystackcell design 1 System Cooling Enhances
Electronic Circuit Reliability
Sam Davis | ED Online ID #16766 | September
27, 2007
Effective thermal management must be employed
at the component level and the system level (see "Shrewd
Thermal Management Helps Defeat The Heat," ED Online
16767). The system may employ good circuit design practices
and reliable components, but system reliability will suffer
if appropriate temperature controls aren't properly implemented.
Available devices, techniques, and software that provide
thermal management at the system level include fans, liquid
cooling, thermally enhanced circuit boards, and thermal
analysis software.
Fans for electronic systems are usually attached
directly to a motor's output, without gears or belts. Motors
for acpowered fans usually use mains voltage, while motors
for dcpowered fans use low voltage, typically 24, 12, or
5 V. Fans for electronic systems usually use brushless dc
motors to minimize electromagnetic interference (EMI). Table
1 lists the characteristics of fans employed in electronic
systems.
A fan inside an electronic system draws cooler
air into the case from the outside, expels warm air from
inside, or moves air across a heatsink to cool a particular
component. The use of fans and/or other hardware to cool
a system is called active cooling. The width and height
of these usually square fans are measured in millimeters,
with common sizes including 60, 80, 92, and 120 mm. Round
fans are also available.
Airflow ratings are in cubicfeet per minute
(CFM) for a rotation speed in revolutions per minute (RPM).
Fans with a higher CFM rating may produce less noise (in
decibels, or dB). Some fans come with an adjustable RPM
so they can produce less noise if the system does not need
as much airflow. The type of bearing used in a fan affects
performance and noise output (Table 2).
System packaging is important when employing
fans for cooling. That is, components mounted on the pc
board should not restrict air flow, particularly higherpower
devices. Heatsink fins should be in line with the flow of
air. In addition, if the cooling system uses air filters,
they should be accessible for cleaning.
Liquid Cooling
A liquid cooling system usually consists of a cold plate,
pump, heat exchanger, and pipes or hoses (Fig. 1). This
thermal management system employs a pump to move a continuously
flowing liquid in a loop that cools a pc board. In operation,
the system's pc board generates heat that transfers to a
thermally conductive cold plate, heating the liquid coolant
flowing through it.
This heated liquid coolant is then pumped
through the heat exchanger, which moves the heat from the
liquid coolant to either the ambient air or, in the case
of a liquidtoliquid heat exchanger, to another liquid coolant.
The cooled liquid coolant then flows through the pipes or
hoses back to the cold plate. Most liquid coolants also
use a small amount of additives to inhibit corrosion and
lubricate the pump.
Cold plates come in different forms. One approach
consists of copper or stainless steel tubes pressed into
a channeled aluminum extrusion. A second technique uses
flat aluminum or copper tubes with an internal fin that
increases their performance. A third type consists of two
aluminum or copper plates metallurgically bonded together
with an internal fin.
Coolant compatibility with a wetted surface
is a factor in selecting a specific coldplate technology.
A copper cold plate is compatible with water and most common
coolants. Aluminum performs well with an ethylene glycol/water
mixture, oils, and other fluids, but is not compatible with
untreated water. Stainless steel is necessary when using
deionized water or other corrosive fluids. Table 3 lists
the possible problems that can occur with liquid cooling
systems and the appropriate corrective measures.
Another liquidbased approach to combat heat
is spray cooling with pinholesized openings that shower
a semiconductor with droplets of a special liquid that won't
damage electronic circuits. Cooling occurs in two ways.
Heat is thought to disperse most efficiently when bubbles
of vapor form as the coolant evaporates from the surface
in a process known as boiling. The coolant also removes
heat by simply warming as it flows over the semiconductor
toward a drain. The liquid and vapor are then collected
and recycled, and a heat exchanger with a slowmoving fan
dissipates the heat they carry.
Thermally Enhanced Circuit Boards
Some electronic systems, such as power modules, exhibit
high power and small size where it's not convenient to use
a heatsink. These modules usually carry high current and
need a high voltageisolation rating. In some applications,
they may have to operate over a temperature range that reaches
up to 200¡(ãà°C.
One type of thermally enhanced circuit board
is the directbond copper (DBC) substrate commonly used in
power modules. It consists of a ceramic base with a sheet
of copper bonded to one or both sides of the ceramic material.
In the manufacturing process, a copperoxygen eutectic bonds
to the copper and ceramic base. The top copper layer can
be chemically etched in a manner similar to conventional
printedcircuit technology. The bottom layer is usually soldered
to a heat spreader.
One type of DBC uses alumina (Al2O3) as the
ceramic base because of its relatively low cost, though
it isn't a good thermal conductor and is relatively brittle.
The aluminumnitride (AlN) DBC is more expensive than alumina,
but has better thermal performance. Beryllium oxide (BeO)
can also be used for the ceramic base, but is usually avoided
because of its toxicity.
A major advantage of DBC substrates is their
low coefficient of thermal expansion (CTE), which is close
to that of silicon. This ensures relatively good thermal
cycling performance for semiconductors mounted on the substrate.
Continued on Page 2...
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3.3GHz Handheld Spectrum Analyzer Includes
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Established Base Station Tester Adds A5/3
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An Electronic Designer's Guide To Thermal
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(60 views today) Nuvation Opens Electronics Design Center
in Shanghai, China
Written by Philip Buonpastore
Monday, 10 December 2007
SAN JOSE, CA Nuvation announced today that it has opened
a design center in Shanghai, China. The company reports
that the new design center will increase the company¡(¯s
offshore capabilities, localize design for manufacturing,
and allow access to the Chinese marketplace.
"Nuvation has always been recognized
by our customers for engineering excellence in new product
development from concept to production," stated Michael
Worry, CEO. ¡(°àh,We are thrilled with the talent joining
our Shanghai team and are looking forward to rapid growth
in this facility."Medical System Integrator
System Assembly Mfg Services Long Life Cycle ISO9000
www.corvalentmedical.com
Electronic Manufacturing
PCA COB BoxBuild Custom Displays Design & NPI, ISO9001
TS16949 RoHS
pciltd.com
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Shanghai National Integrated Circuit Design Industrial Center
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Fuyuan Electronic MFG. Company China (mainland)
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