Electronic Assembly - Communications Cable Assembly and PCB Assembly

We are involved in the assembly of communication cables for networking as well as PCB assembly. The assembly of the communication cables as well as PCB assembly is done by us at our well equiped Electronic assembly Workshop located in the vicinity of our office at Ponda, Goa. On the right you can view the Crimping of the Communication Cable. The assembly job works done by us include Bookmark Website Bookmark Page Contact UsSubscribe

Kitron’s Q2 Profit Down 37% YoY
Written by Chelsey Drysdale
Thursday, 12 August 2010 18:06
BILLINGSTAD, NORWAY – EMS firm Kitron reported second-quarter 2010 revenue of NOK 425.7 million, up 1.3% compared to the same quarter last year on higher medical demand.

Profit before tax and discontinued operations was NOK 1.7 million, down 37% year-over-year.

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EMS Deals Continue to Outpace ‘09
Written by Mike Buetow
Thursday, 12 August 2010 17:56
CHICAGO – The rebound in orders in the EMS sector has brought with it an uptick in M&A activity.

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More Articles...

Henkel Opens New Adhesive Electronics Facility
Winland Electronics' Q2 Sales Down More than 10%
ITW Acquires Ion Systems
Foxconn's July Sales 2d Highest Ever
Nortech Continues Climb; Q2 Back in Black
API Swings to Q4 Profit on Record Sales
Fire Halts Plexus Oradea Ops
Report: Foxconn to Construct PC EMS Plant in Turkey
Nordson Merges Dage, YesTech Units
Viasystems' EMS Sales Up 21% QoQ

Columns
Problems and Promises of BTCs
What are bottom termination components? You may not know the term “BTC,” but because IPC is focusing on these packages, expect to hear more about them.
IPC has coined the term BTCs for descriptive package names such as QFN, DFN, SON, LGA, MLP, etc. They are in some ways similar to BGAs, which also have hidden terminations, but they are also very different. They do not have balls, but rather, metalized terminations or pads underneath the package.

Most, but not all, of BTC packages have a large ground or power termination surrounded by smaller signal terminations. When it comes to inspection, they pose even more challenges than BGAs, which permit inspection by endoscopes. You may not be able to see side solder fillets, and even when you can, they may look non-wetted or dewetted. But, dewetted and non-wetted side fillets in BTCs are acceptable.

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Getting 'Up' for '60 Minutes'

Rob bolted upright in bed. He had that terrible feeling that he had overslept for an important appointment. His eyes quickly found the clock and it said Electronic Assembly Training Workshops

Mukul Luthra, an expert consultant with over 30 years of electronic assembly experience in high volume manufacturing, quality and process engineering, presents a series of hands-on training workshops that address critical modern electronic assembly challenges. Custom electronic assembly training workshops are also available to meet your specific needs.

For more information: register to download the Electronic Assembly Training Workshops brochure in .pdf format

Workshop 1
Lead Free Interconnection – Technology and Manufacturing

This two-day course provides a solid foundation in Lead Free Soldering from Legislation, Equipment classes impacted, to the Metallurgical interactions and process impacts. These are dealt with in the light of current trends, solders and metallization with emphasis on dealing with the many soldering issues encountered in the Lead Free conversion process.

This workshop is divided into ten modules that include: Lead Free drivers, inspection, soldering alloys, soldering metallurgy, alloy options, Lead Free process considerations, reliability, surface metallization, and process issues.

Who Should Attend: Those responsible for implementing Lead Free technology, maintaining Lead Free yields, and for those roles that directly impact yields in Manufacturing, Assembly, Equipment Maintenance, Failure Analysis, Vendor Quality, and Incoming Quality.

Workshop 2
BGAs and CSPs – Structure, Assembly Process and Rework

A two-day intensive workshop that covers in-depth aspects of BGAs, Micro BGAs, and Bumped Array CSPs, including their structure, families, advantages, features, assembly of the device on the PCB and rework processes. Attendees will acquire an excellent understanding of the attachment variables, assembly requirements, assembly variants such as mirror image assembly, the process issues that may be encountered and how to troubleshoot and correct them.

This program is organized into seven modules that include: packaging drivers and BGA trends, BGA and Array CSP assembly considerations, imaging techniques, understanding and eliminating defects, Chip Scale Packaging (CSP), and rework.

Who Should Attend: Engineering personnel from Manufacturing, Assembly, Equipment, Materials and Failure analysis disciplines. The course is also extendable to Technicians or Supervisory levels.

Workshop 3
Advanced SMT – Practical Approaches and Techniques for SMT Process Enhancement

Through this two-day workshop delegates learn about the latest trends in packages, grasp the complex interaction between variables, and discover how to control and manage them for a successful process. The workshop focuses on small form factor, miniaturization and advanced packages assembly and control. Participants also learn how to deal with typical and difficult issues, from mainstream assembly to many of the new devices and attachment methods.

This course has twelve modules that include: SMT directions, process considerations, Lead Free challenges, reflow engineering, wave soldering, soldering metallurgy, BGA and CSP assembly and control, Chip-On-Board (COB) in mainstream SMT, Flip Chip (FC) processes, analytical tools, and improving rework yields.

Who Should Attend: Engineering personnel from Manufacturing, Assembly, Equipment, Materials and Failure analysis disciplines. The course is also extendable to Technicians or Supervisory levels.

Workshop 4
Direct Chip Attachment in Mainstream SMT – Selection, Design and Processing

DCA has gained tremendous importance in the evolving field of SMT with ‘Bare Dies’ being thought of by many as the next ‘Wave of Packaging’. This two-day workshop covers and provides an understanding of the selection criterion and considerations for bare dies, their quality and acquisition. It also covers Flip Chip (FC) and Chip-On-Board (COB) attachment technologies in terms of positioning, design guidelines and attachment considerations, usage, equipment, process development and analysis with real life examples.

This workshop is divided into eight modules that include: direct chip attachment, bare dies, Flip Chip design rules, Flip Chip attachment, failure analysis, and Chip-On-Board attachment.

Who Should Attend: This is a high level program that targets personnel from Engineering, Process, Manufacturing, Assembly, Failure Analysis and Quality disciplines.

Workshop 5
Tin Whiskers – Structure, Causes, Impacts and Control Strategies Practical, hands-on workshop. Includes over 240 examples of good and bad design for manufacturability and assembly practices. Includes exercises to reinforce understanding of principles and analysis of company assemblies to transition learning back to your workplace. The three-day workshop includes one day on-site prior to the workshop to customized it to your products and processes.

1. DESIGN FOR MANUFACTURABILITY/ ASSEMBLY (DFM/A)

DFM/A Introduction
Design Impact on Cost
DFM/A Fallacies vs. Reality
2. DESIGN FOR ASSEMBLY

Principles of Design for Assembly
Simplify Product Architecture
Modularity and Structure with Architecture
Partitioning, Collocation, and Orientation Effect on Interconnections
Modular Design vs. Integral Design
Simplicity - Minimize Part Count
Minimize Parts Exercise
Standardization - Minimize Part Variety
Standardization Approach and Method
Mistake-Proof Assembly - The Six Mistake-Proofing Principles and the Relative Benefit
Elimination Principle and Examples
Replacement Principle and Examples
Prevention Principle and Examples
Facilitation Principle and Examples
Detection Principle and Examples
Mitigation Principle and Examples
Mistake-Proofing Approach and Methodology
Mistake-Proofing Exercise - Identify Mistake-Proofing Opportunities
Assembly Process Framework
Design for Parts Feeding & Handling
Design for Part Orientation
Considering and Applying Symmetry vs. Asymmetry
Measuring Symmetry - Alpha, Beta and Combined Symmetry
Design for Location and Insertion
Minimize Flexible Parts
DFA Considerations with Gaskets, Interconnections, & Connectors
Axes of Assembly, Reorientation & Blind Assembly
Top Down, Uni-Axis Assembly
Self-Fixturing vs. Production Fixtures
Joining & Fastening Guidelines
Integral Attachment (Self-Fastening & Snap-Fit Assembly) Guidelines
Threaded Fastener Considerations & Guidelines
Adhesive Joining Guidelines
Welding Guidelines Electronic Assembly Manufacturer For Sale - Orange County, California
Ad/Listing Information
Contact Information

Status: Available

Location: Orange County

County: Orange

City: None Given
Contact Broker: Steve Thomson

Primary Phone: 714-619-9310

Alternate Phone: None Given

DRE Number: None Given

Email Address: Email Advertiser

Date Started: 6/14/10

Date Last Revised: 7/23/10

BizBen Ad #: 155268



Financial Information Detailed Information

Price: $224,990

Down: Call/Email

Revenue: $320,000

Adj. Net: $50,000
Relocatable: No

Home Based: No

Real Estate Included: No

Bkr To Bkr Coop: No
Franchise: No

For Sale By Owner: No

Asset Sale: No

Lifestyle: No

Description Of This Orange County Electronic Assembly Manufacturer Business For Sale:
This southern California based Electronic Assembly Company has been serving local clientele for 38 years from their north Orange County location.

Their niche is smaller jobs, where fast turnaround is paramount. Customers include military contractors, commercial firms, medical companies and electronics manufacturers. Because of it's long and successful history, this company enjoys many repeat customers.

Sales have been as high as 1.5 million over the years, however, recently, sales and marketing efforts have slowed. This business needs new ownership with a keen eye toward expanding the customer base. Conference
Building on the success of the 2008 conference, the Electronics Assembly Reliability and Yield Enhancement Summit begins on Tuesday, 21st September with a wide range of workshops from many of the leading experts in the field.

On Day Two, the conference starts with a Plenary Session comprising some of the best individual paper submissions. In the afternoon this breaks out into three dedicated tracks and a workshop.

The specialized tracks continue on Day Three and the conference culminates in the afternoon with the second half of the Plenary Session.

Below is the schedule of workshops for Tuesday, September 21st. We will be posting the full conference schedule soon.

Tuesday, September 21st
Tuesday is dedicated to workshops. A 30-minute coffee/Blackberry break is scheduled during both the morning an afternoon sessions, the first at 10:30 am and the second at 3:30 pm. Lunch runs from 12:30 pm to 2:00 pm. The tabletop exhibition will be available during these times as well.

Morning Session
9:00am-12:30pm Afternoon Session
2:00pm-5:30pm
Workshop One
Flexible Circuit Technology – Structures, Materials, Design Practices and Manufacturing Processes
Presented by Joe Fjelstad Workshop One
Advanced Packaging Technologies and Future Interconnection Trends
Presented by Joe Fjelstad
Workshop Two
Enhance Quality by CIP Integrated Inspection
Presented by Thomas Ahrens, Trainalytics GmbH Workshop Two
Soldering reliability – understanding the metallurgy and application modeling
Presented by Thomas Ahrens, Trainalytics GmbH
Workshop Three
Gerber Data Analysis in Electronic Production, Gerber3 Seminar (part 1)
Presented by Jennifer Vincenz, The “LeiterplattenAkademie GmbH” (i.e. “PCB-Academy”) Workshop Three
Gerber Data Analysis in Electronic Production, Gerber3 Seminar (part 2)
Presented by Jennifer Vincenz, The “LeiterplattenAkademie GmbH” (i.e. “PCB-Academy”)
Workshop Four
Solder Joint Reliability—Part 1: Fundamentals in Solder Joint Reliability
Presented by Werner Engelmaier Workshop Four
Solder Joint Reliability-Part 2:
Failure Mode and Root Cause Analyses (Fatigue, Brittle Fracture, ENIG)
Presented by Werner Engelmaier
Workshop Five
Cleaning in Electronic Production—Basic Requirement for Long-term Reliability
Presented by Alexandra Rost, ZESTRON Europe Workshop Five
Conformal Coating
The first half is presented by Dr. Manfred Suppa, LACKWERKE PETERS GmbH + Co KG. The second half is presented by Lars Nielson, Nordson ASYMTEK
Workshop Six
Key Issue System Reliability, Evaluation along the Complete Supply Chain
Presented by Viktor Tiederle, Fa. Relnetyx AG Workshop Six
Solder Paste Printing – Opening the Black Box for Continuous High Quality Printing
Presented by Axel Lindloff, DEK Printing Machines

They are fortunate in having a long term, loyal workforce, who would most probably stay on under new ownership. Currently 9 assemblers are employed.

The current lease expires in February of 2011 allowing the new owners the flexibility of moving the location or renewing in the current facility.

The seller would like to retire but is willing to stay on to help transition the business for a mutually agreed to period of time.

Sales: 320,000
Furniture, Fixtures and Equipment: 50,000
Seller's Discretionary Cash Flow: 50,000
Asking: 224,990

Disclaimer: The information above was furnished by the seller. Sunbelt Business Brokers of Orange Coast or its agents have not verified the information and makes no representations as to its accuracy or reliability.

Other Fastening Methods and Guidelines
Finishing, Adjustment & Calibration
DFA Considerations to Facilitate Test and Inspection
Applying DFA to Packaging - The Final Assembly Step
Case Studies and Benefits - Aerospace, Automotive, Electronics, Mechanical Machinery
Design for Assembly Analysis Exercise
2. DESIGN FOR AUTOMATED ASSEMBLY (optional module)

Production Considerations for Manual, Flexible Automation and Hard Automation
Cost / Benefit Analysis of Automation
Design for Feeding Guidelines
Feeding Systems & Orientation
Flexible Automation
Design for Robotic Assembly Guidelines

The objective of this one-day Workshop is two fold. Firstly the workshop will lay a foundation and understanding of the Tin Whiskers, their morphology, microstructure and review the risks and extent of impact on the end product. The course will detail the studied growth mechanisms and conditions including the impact of the environment on whisker growth and compare the various investigations and growth propositions.

The second part of the workshop will deal with the control aspects and the strategies for control including for example, the use of conformal coatings to mitigate the formation and growth of Tin Whiskers. [Conformal coatings are mentioned here as an example as being of the few processes actually under the control of the end user].

This program is organized into four modules that include: Overview of Tin Whiskers, whisker growth models, control strategies and challenges.

“Wait a minute!” he thought, “It’s Sunday.”

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Features
High Thermal Mass, Very High Lead Count SMT Connector Rework Process
Rigorous testing found local vapor phase clearly superior to alternative processes.
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SEA, NPI Awards Revealed
On April 6 in Las Vegas, CIRCUITS ASSEMBLY handed out its annual Service Excellence Awards for the 18th time. The program recognizes EMS providers and electronics assembly equipment, materials and software suppliers, as judged by entrants’ own customers.

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Complete PCB Assembly job work which includes placing on components on circuit board manual as well as machine soldering using wave soldering machine and Testing of the assembled boards.
Assembly and Testing of communication cables.
Assembly and Testing of communication cables for interfaces like RS-232 and RS-485.